DEVELOPMENT OF THE RESEARCH ON THE THERMAL FATIGUE LIFE PREDICTION OF PACKAGING STRUCTURES

doi:10.6052/1000-0992-1996-1-J1996-009

Volume 26 Issue 1

Feb. 1996

Turn off MathJax

Article Contents

Article Navigation > Advances in Mechanics > 1996 > 26(1): 107-113

DEVELOPMENT OF THE RESEARCH ON THE THERMAL FATIGUE LIFE PREDICTION OF PACKAGING STRUCTURES[J]. Advances in Mechanics, 1996, 26(1): 107-113. doi: 10.6052/1000-0992-1996-1-J1996-009

Citation:

DEVELOPMENT OF THE RESEARCH ON THE THERMAL FATIGUE LIFE PREDICTION OF PACKAGING STRUCTURES[J]. Advances in Mechanics, 1996, 26(1): 107-113. doi: 10.6052/1000-0992-1996-1-J1996-009

DEVELOPMENT OF THE RESEARCH ON THE THERMAL FATIGUE LIFE PREDICTION OF PACKAGING STRUCTURES[J]. Advances in Mechanics, 1996, 26(1): 107-113. doi: 10.6052/1000-0992-1996-1-J1996-009

Citation:

DEVELOPMENT OF THE RESEARCH ON THE THERMAL FATIGUE LIFE PREDICTION OF PACKAGING STRUCTURES[J]. Advances in Mechanics, 1996, 26(1): 107-113. doi: 10.6052/1000-0992-1996-1-J1996-009

PDF( 639 KB)

DEVELOPMENT OF THE RESEARCH ON THE THERMAL FATIGUE LIFE PREDICTION OF PACKAGING STRUCTURES

doi: 10.6052/1000-0992-1996-1-J1996-009

清华大学工程力学系;

Publish Date: 1996-02-25

Abstract

Abstract

In this paper, an overview of the development of prediction study on the thermal fatigue life of electronic packages is presented, including theore-tical and experimental aspects as well as failure mechanism analysis. A pro-phecy on the research trend in this area is suggested.
- high density,
- packages multilayed film structure,
- solder joints,
- thermal fatigue I life,
- strain amplitude