The rapid developments of Microelectromechanical systems (MEMS) promote studies on testing microscale mechanicalproperties for their materials. Firstly, recent methods for testing microscale mechanical properties are summarized, based on four distinct types of tests, nanoindentation/scratch, beam and film bend, tension, and torsion. The integration of the sample and loading system on the microscopic scale is explained in detail. Si, SiO2, Si3N4, Au, Ti, Ni are used in these tests. Experimental results are introduced, including elastic modulus, residual stress, yield strength, fracture strength, fatigue strength, and so on. Finally, a brief discussion on future developments is given.